Offline wafer UV laser cutting system

date:2021/2/2 18:05:20 / read: / source:本站

Offline wafer UV laser cutting system


1. Product Description

This equipment adopts ultra-fast laser, coordinated with software control, and precision platform system, which can realize rapid cutting of glass and sapphire, with edge collapse less than 10um.


2. Equipment application and industry

This equipment is suitable for fast shaped cutting of glass and sapphire with DOL<50um, mobile phone cover glass, camera protection lens, home button cover, optical lens, car glass, etc.


3. Processing advantages

  • Non-contact processing, less damage to materials, high cutting accuracy
  • Layered three-dimensional cutting, can be used to cut non-strengthened and strengthened glass
  • Laser single point action time is short, heat affected area is small, and no glass debris is generated
  • High-speed cutting with linear motor, high efficiency


4. Technical Parameters

Power

30W<1mm70W<5mm

Wavelength

1064nm

Processing range

300mm*300mm

CCD positioning accuracy

±0.003mm

Positioning accuracy

±2um

Repeat positioning accuracy

±1um

CCD positioning accuracy

3um

Cutting thickness

0.1-1.5mm

Pulse width

<10ps

Total Weight

≤3T

Laser Type

Infrared picosecond

Power specifications

220V/1 PH/50Hz/16A /3.5KW

Power specifications

380V/3 PH/2.5KW



5. Pictures

1000#Offline wafer UV laser cutting system

2000#Offline wafer UV laser cutting system

3000#Offline wafer UV laser cutting system

4000#Offline wafer UV laser cutting system

5000#Offline wafer UV laser cutting system

6000#Offline wafer UV laser cutting system

6000#Offline wafer UV laser cutting system




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