Glass laser cutting equipment

1. Product Description

This equipment is a fully automatic roll-to-sheet precision laser processing equipment. There are three types of UV nanoseconds, green picoseconds, and UV picoseconds to choose from, to meet your different requirements for applications and maximize cost efficiency. This equipment is suitable for the cutting and forming of cover film (CVL), flexible board (FPC), flexible and rigid board (RF) and thin multilayer board, as well as the opening of the window box; it can be extended to cut various substrates, 5G LCP antenna, OLED silicon chip and special materials, etc.

2. Equipment application and industry

The equipment can cut all kinds of PCB, FPC, SD card, TF card, cover film (CVL), fingerprint module, mobile phone camera module, soft and hard board (RF), window box and cover.It is widely used in industries such as integrated circuits, PCB boards, FPC, 3C, medical treatment, and consumer electronics. 

3. Processing advantages

• According to the thickness of different products, the focal length of CCD and laser are kept the same, and the MARK point capturing effect is accurate.
• Double-head spectroscopic cutting, which can meet the covering film and shape cutting at the same time, one-key switching, saving time and effort.
• Professional customized cutting software, simple and convenient operation, convenient and quick refueling operation, and high degree of flexibility.

4. Technical Parameters

Output Power	30W
Wavelength	532nm
Speed of light quality	M2﹤1.1
Security Level	CLASS  Ⅳ
Positioning accuracy	±2um
Repeat positioning accuracy	±1um
Visual accuracy	±3um
XY axis travel	300*600mm
Marking range	50*50mm
Total Weight	﹤1800kg
Overall size	1900*1330*1950mm
Total power	﹤5kw
Power specifications	AC220V±10% 50hz/20A

5. Pictures

1000#Glass laser cutting equipment

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