Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
date：2020/9/16 8:59:59 / read： / source：本站
Die Bonding
1. Product overview:
The product is taken out of the magazine through the precision conveying track, and the wafer is automatically peeled and loaded and accurately positioned; the multi-axis high-precision manipulator is guided by the industrial camera to complete the precision dispensing and wafer loading process for the product.
2. Equipment application and industry:
The semiconductor production process and the dispensing and bonding process of the CCM camera module can meet the position accuracy requirements of the upper and lower assembly and bonding.
3. Product features:
(1) High efficiency, overall UPH≥5000 pcs
(2) High yield rate ≥ 99.9% (except for product incoming factors)
(3) High accuracy, XY position accuracy: ±5μm deflection angle ±0.2°bond head pressure 100~1000g (programmable);
4. Technical Parameters
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100#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
200#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
300#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
400#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
500#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
600#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
700#
Hot Selling Die Bonding Machine for Semiconductor with Reliable Performance
writer：admin