Offline wafer UV laser cutting system
date：2021/2/2 18:05:20 / read： / source：本站
Offline wafer UV laser cutting system
1. Product Description
This equipment adopts ultra-fast laser, coordinated with software control, and precision platform system, which can realize rapid cutting of glass and sapphire, with edge collapse less than 10um.
2. Equipment application and industry
This equipment is suitable for fast shaped cutting of glass and sapphire with DOL<50um, mobile phone cover glass, camera protection lens, home button cover, optical lens, car glass, etc.
3. Processing advantages
- Non-contact processing, less damage to materials, high cutting accuracy
- Layered three-dimensional cutting, can be used to cut non-strengthened and strengthened glass
- Laser single point action time is short, heat affected area is small, and no glass debris is generated
- High-speed cutting with linear motor, high efficiency
4. Technical Parameters
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5. Pictures
1000#Offline wafer UV laser cutting system
2000#Offline wafer UV laser cutting system
3000#Offline wafer UV laser cutting system
4000#Offline wafer UV laser cutting system
5000#Offline wafer UV laser cutting system
6000#Offline wafer UV laser cutting system
6000#Offline wafer UV laser cutting system
writer：admin