Single wafer cleaning equipment

date：2020/9/16 9:21:00 / read： / source：本站

Single wafer cleaning equipment

1. Product description:

The self-adhesive parts on the material belt are pulled by the drive device to the stripping plate under the suction device, and the self-adhesive leads are pulled off by a series of tensioning guides. Automatic placement on the workpiece positioned by the jig.

2. Equipment application and industry:
This equipment is specially used for the lamination process before wafer (sheet), QFN, glass, substrate, etc. cutting. It only needs to manually place the product and the frame to complete the lamination process with one click.

3. Product features:
(1) Smart film detection
(2) Adjustable filming speed control
(3) Suitable for blue film, UV film, PET substrate film and other single/double film
(4) The working plate adopts imported heating system
(5) The height of the working plate can be adjusted to adapt to different thickness products
(6) One-button start to execute fully automatic work flow.

4. Technical Parameters

1. Applicable Wafer size	standard：4inch，6inch，8inch Please inquire about options for compatibility with specific wafer size
2. Model	Dwin- Single wafer cleaning equipment -02B
3. Yield	99%
4. High efficiency	Overall UPH≥3000pcs
5. Equipment cleanliness level	Grade 100
6. Height of operation table	900±50 mm
7. Machine Dimensions	L1400 xW1600H1800mm 1000Kg
8. Air source specification	>0.5MPa （Clean, without oil and water） >400L/min
9. Power specifications	AC220V
10. Total power	1KW

5、product pictuers