die bonder automatic
date：2020/9/16 8:59:59 / read： / source：本站
Die Bonding
1. Product overview:
The product is taken out of the magazine through the precision conveying track, and the wafer is automatically peeled and loaded and accurately positioned; the multi-axis high-precision manipulator is guided by the industrial camera to complete the precision dispensing and wafer loading process for the product.
2. Equipment application and industry:
The semiconductor production process and the dispensing and bonding process of the CCM camera module can meet the position accuracy requirements of the upper and lower assembly and bonding.
3. Product features:
(1) High efficiency, overall UPH≥5000 pcs
(2) High yield rate ≥ 99.9% (except for product incoming factors)
(3) High accuracy, XY position accuracy: ±5μm deflection angle ±0.2°bond head pressure 100~1000g (programmable);
4. Technical Parameters
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100#
die bonder automatic
200#
die bonder automatic
300#
die bonder automatic
400#
die bonder automatic
500#
die bonder automatic
600#
die bonder automatic
700#
die bonder automatic
writer：admin